Conduction cooled vme chassis. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Conduction cooled vme chassis

 
The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systemsConduction cooled vme chassis An open-frame solution for the open-minded engineer

The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Switches, bridges and clock modules (PXIe), and even cooling are modular allowing for easy customization. Description. ACT manufactures copper/water heat pipes into two basic geometries: Tubular Heat Pipes and Planar Heat Pipes. 10. Because VITA 48. 54 mm) pin spacing, CompactPCI cards use metric connectors with a 2-millimeter pin spacing, designed to the IEC 1076. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. Backplane is Fabric Mapping Module overlay-ready and configurable to meet any data plane connection fabric. CompactPCI Serial Chassis. With 6U-VME conduction cooling, power dissipation per slot is limited by the cold plate on which the chassis is mounted. Power Supplies. CompactPCI Serial Chassis. Operating Temperature > 8 slots: 0°C. Modernize VME & mezzanine systems with high-performance switching & routing. Dawn VME Intelligent 6U 1600W VITA 62 DC wedgelock conduction cooled power supply (i. High Quality Chassis and Enclosures for 3/6U VPX and OpenVPX Applications. 0 in. VPX-REDI defines design parameters for enhanced cooling features and maintenance strategies to effectively support the increased power draw of high-density electronic systems. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. From our extensive line of COTS chassis to the most intricate custom solution, Hartmann is the most trusted resource for all rack-mount and desktop chassis needs. See Details. Dawn created the “CUBE” family of enclosures to address the needs of the UAV market. Even though conduction cooling typically is the least expensive thermal-management approach for rugged systems, it still introduces some costs in the form of metal card edges that conduct heat. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. Supports air cooled and optionally conduction cooled boards. CPCI Chassis. Chassis is cold plate base coupled conduction cooled and rated for operation over -40 to +85°C range. 8” slot. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through. Chassis: 1 ATR, 6U 11-slot, VME/VPX-based conduction-cooled solution. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a system’s card components. It is based on the established PICMG 2. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10. 20-n FeaturesDescription. PSC-6238. 8 designs, he says. These forced-air-cooled, fully ruggedized chassis are designed to meet the rigorous standards of MIL-STD-810 F/G and DO-160 while integrating the latest power-saving and performance-enhancing technology. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. Radstone or third-party ATR style enclosures. CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; OpenVPX 6U 8-slot ATR Chassis; RME-6460 6U VPX 2-16 slots Rack Mount EnclosureThis 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. 59"L x 4. 8” pitch versus a typical 1. Heat frames can be designed for compliance with many industry standards. Embedded RuSH Technology monitors Power Supply voltage and current on all 6-channels, plus temperature, and (optionally) humidity. Boards are clamped in place using expanding screw driven wedgelock assemblies and cooling is entirely by conduction through internal. Cooling: Conduction cooled. 3U 2 Slot OpenVPX Development Chassis. Ruggedized versions are also available. This large scale, naval system had a complete HiK™ back-plane and utilize natural convection cooling. 16. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. Conduction cooling is defined as the transfer of heat through solids. face of the chassis, the area most likely to be damaged if the unit is accidentally dropped. VME / VME64x Chassis. The standard model is conduction to wedge lock cooled with an operating temperature range of -40C to +85C and a non-operating range of -55C to +105C. The VPX340 (400W) and VPX336 (360W) can be used to power VPX / Open VPX chassis and will fit into the standard envelope defined by VITA 48. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. The convection bridge is clamped between the VME. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. CompactPCI Serial Chassis. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. Configuration: • No Modules Installed. 65 in. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. 8 GHz : 2x PMC/XMC : Rugged Air Cooled and Conduction Cooled : Available in multiple ruggedization levels : SBC314C Flight-Certifiable Single Board ComputerVPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. +85°C. Provides up to an 5-slot system for 6U convection or conduction cooled boards and 6U transition modules on 1. Now available from electronics packaging specialist Schroff is a range of conduction-cooling assemblies (CCAs) that have been designed specifically for use in. The C162 is based on Intel’s Calpella (Arrandale + ECC) platform comprising an i7 dual-core/four thread (Intel Hyper-Threading® Technology) processor with large integrated on-chip L1, L2 and shared L3 caches as well as a companion QM57 PCH I/O. 3U CompactPCI 2. or 1. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. 5A, 3. COTS approach to conduction cooled modular computers COTS mechanical rules for conduction cooled modular board computers in the eurocard form factor were standardized in 199 by IEEE Std 1101. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 2, VITA 30. 3/4 ATR, conduction-convection cooled. Description. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. 8 in. 3U Air cooled models available in 1. 20 dimensions for conduction cooling, and meets the VITA 47 ECC4 ruggedization specifications for shock, vibration, and operating temperature range of -40° C to +85° C. Designed for rugged conduction cooled assemblies (CCAs) in VPX systems,. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. e. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. It is conduction-cooled through the card edge/wedgelock. Form Factor: 6U VME Processor: NXP QorIQ T2080 Memory: 8 GB DDR3 Ethernet: 8 10/100/1000BASE-T USB: 1 USB 2. These enclosures support 3U and 6U backplanes and are. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 0 in. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. Open VPX is the architecture framework that defines system level VPX interoperability for. 3V, 5V, +12V_Aux, -12V_Aux & 3. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. PXI /. While conduction cooling dominated rugged embedded computing systems just a few years ago, the trend today is shifting to approaches that blend-in air cooling like VITA 48. Rugged Conduction Cooled Assemblies and Modules. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression Coolers) Enclosure. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. 62H. Standard features include protection against transients, overvoltage. This 5 slot Hartmann VPX 4U system chassis provides an intelligent, practical packaging solution for high-performance processors. 3U VPX, 1/2 ATR, Conduction Cooled. 600-Watt DC/DC Converter, 6U VME. Please contact us using the form to the left or at 407-845-1700 to discuss your requirements in detail. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810F/G while integrating the latest power-saving and performance-enhancing technology. Both managed and unmanaged versions are available to support air-cooled and rugged conduction-cooled defense and aerospace applications. Ordering Information: Dawn P/N 11-1017632-01. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Hartmann Electronic’s slimmest 19” rack mountable VME solution – The VME64x 1U system. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Additional backplanes are available, including VME,. Airborne, shipborne and ground deployment. 0 specification for use in Mil/Aero VPX systems. Thermal design, simulation and analysis services. Show More Description. Reliable VME form factor PXI Express Chassis. Height: 7. 08 of Vita65. 66A steps, 3V3_VS2 0A. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. 8” slot. Important Notice: Other accessories, manuals, cables, calibration data, software, etc. The VME/PMC 64x Conduction-Cooled Carrier is a 6U VME card that supports up to two (2) PMC modules. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. +70°C, ≤ 8 slots: -40°C. Optimized for conduction cooling. XCalibur1931 NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 6U VME SBC with Eight Gigabit Ethernet Ports The XCalibur1931 single board computer provides up to 8 GB of DDR3. FREMONT, Calif. For use in DC systems, they are 6 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. The tubular heat pipes typically have outer diameters from 1/16″ (1. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. 2 (REDI) and VITA 65 (OpenVPX). Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. In addition to theseThe Conduction Cooling Experts: Advanced Thermal Management Equals Reliability With a heritage of more than 30 years, Curtiss-Wright has long been recognized as the COTS industry’s leading expert in the design of conduction cooled standards based modules. 11 system management, OpenVPX tier 2 chassis manager, VPX, conduction cooled, SOSA - Pixus Technologies. 3) CompactPCI Serial is an industrial standard for modular computer systems. Air-Cooled Scroll Modular. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Hartmann Electronic designs and manufactures high speed backplanes, electronic Chassis, and more for micro-computer. 52”L x 7. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. This system is downward-compatible, so that assemblies with VME 96-pin connectors can still be used, while adopting the use of serial signals such as Gigabit Ethernet, PCI Express, Serial RapidI/O, and other. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. 10 Slot VME Rugged ATR SIGINT Chassis 10U VME64X Ground Mobile Rugged Enclosure 11 Slot SOSA Development System. ATR Chassis. 3-n (Slots: 5 nodes, 1 storage, 1 switch) Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. It features 4 slots of 3U VPX on 1 in. Defense applications require a range packaging approaches and LCR has the proven products to meet mission objectives with ATRs for SWaP constrained installations or 19-inch chassis for larger scale computing needs. The standard model is conduction to wedge lock. 3U Conduction Cooled VPX Extender. These rugged enclo-sures are available to support either one-inch or 0. Full environmental sealing insures reliable operation in any environment. Rugged Rackmount. 3 V. Description. 3U/6U (VPX / cPCI/ VME) Backplane Options. This platform supports up to eight 0. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid VME64x/VITA46/48 VPX 5-slot Development System VME-VME64 6U 162 Series. Our modular, aluminum chassis variants give you many different and interchangeable options for VPX and cPCI, as well as our rugged small form factor VITA 73. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. About. Height: 10. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. Embedded RuSHTM technology. Pixus has a wide variety of modular 19" rackmount, desktop, and ATR enclosure platforms for CompactPCI Serial systems, allowing virtually limitless configurations. a VME chassis. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. SOSA™ Aligned Technology CapabilitiesThis rugged 3U VPX air conduction-cooled chassis from Elma is for avionics, land vehicles, and other military SWaP-constrained applications. pitch conduction-cooled VPX (VITA 48. With moveable rear profiles (up to 2. Liquid Cooled ATR Enclosure. Its industry standard Tundra Universe II VME/PCI bridge chip assures compliance with VME and PCI Bus standards. {VME Rugged Chassis manufacturer} MCH Systems {Rugged retma rackmount and ATR VME chassis}Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. XCalibur1931. Compared to conventional wedgelocks, the ICE-Lok ® creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. 2. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Intelligent VPX Test Module, also System Monitor and Load Board. PXI /. Relative Humidity: 90. PICMG 2. pdf;Physical Characteristics. 3-n. ATR Chassis For Conduction-Cooled VME Boards Product Information Radstone ATR chassis provide the highest level of environmental protection combined with exceptional packing density and thermal performance. With the VPX3-663, designers can create switched networks that allow any module in the system to connect to any. Ability to work with existing board, frame, or chassis designs. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. PSC-6234 3U 400-Watt 6-channel plug-in or bulkhead mounted Power Supply for conduction cooled OpenVPX systems. Advanced Cooling Technologies, Inc. Full environmental sealing insures reliable, all-conditions operation. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 11 modular extrusions. 100G Ethernet Data plane. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. AC and DC power input variants available. Additional backplanes are available, including VME, VME64x, VXS, CompactPCI. The Curtiss-Wright Defense Solutions rugged, conduction-cooled, network centric flight control and management computer is designed to operate in a rugged UAV environment and provides a total flight control solution backed by substantial technical maturity and heritage. 8” slot. Chassis Platforms Product Type Elma Air Transport Rack (ATR) enclosures offer a standardized, cost effective solution for VME, VME64x, CompactPCI, VXS, VPX and Small Form Factor (SFF) based applications. Backplanes options - cPCI, PCI, VME64x, VME/VME64, VPX and custom. The card slots within a chassis hold the heat frames that PCB boards attach to. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. CAD templates and 3D printed prototypes available. 3U Convection Cooled. (L) x 4. C: 70 Input 28VDC: 1. GS16. Applying our years of rugged MIL-STD 810 and 461 design experience, our EPACK/S systems provide the highest degree of environmental rugged design with latest technologies of conduction-cooled, air. 1-1997 while providing a low profile, practical packaging solution for high-performance. VPX is specified for 3U and 6U boards and for air cooled, conduction cooled and even liquid cooled chassis. 1 PICMG 2. 2 (REDI) and VITA 65 (OpenVPX™) † 6U, 7-slot backplane, 1” pitch per VITA 65 Backplane Profile BKP6-CEN07-11. Card Thickness: 2. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1″ pitch per VITA 65 Backplane Profile BKP6-CEN07-11. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. 3U CompactPCI. The up to 800 Watt power output true 6-channel supply provides full Open VPX support and is current/load share compatible with up to 4 PSC-6238 units. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. Wedge lock conduction cooled module. VPX Extender Cards Product Datasheet. VME 64x 6U 166 Series. Add to Cart. VXS offers backwards compatibility for existing VME/VME64x line cards for payload slots. 3U / VITA 62 / 400W. Aids in locating hot spots in the chassis. Conduction-Cooled. Relative Humidity: 90. Go-No-Go indicators for 12V, 3. Provision for mounting GPS/1PPS/10MHZ source in the chassis. This thin VME chassis comes with a 300W cPCI hot-swap power supply and horizontally oriented card slots. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. PXI /. VPX combines best-in-class technologies to assure a very long technology cycle. . Airborne, shipborne and ground deployment. 6U / VITA 62 / 580W. Aitech Defense. Find VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of VME Chassis information. X-ES embedded 3U VPX Single Board Computers (SBCs) offer unparalleled performance from their cutting-edge Intel® Core™ i7, Intel® Atom™, Intel® Xeon® D, or NXP (formerly Freescale) QorIQ processors. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. Heat generated inside the chassis by the electronics flows into the chassis aluminum sidewalls and down into the cold plate. • (3) DB-9 Ports. The power supply options range from a 400W ATX for low end applications to a 1200W modular supply for high end power requirements. Subrack based, sheet metal, desktop or tower configurations. CompactPCI Serial Chassis. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. Conduction cooling moves the heat from the printed board through a heat transfer surface to the chassis walls and structure where the air circulating nearby removes the heat. 8 in. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. Subrack based, sheet metal, desktop or tower configurations. Rather than a single specification, VPX is a set of base, environmental, mechanical and dot specifications, defining several – mainly rugged – capabilities and features for new VITA-compliant systems. 15A in 1A steps, +12V_AUX 0. Optionally the customer can have conduction cooling arrangement for single slots or for the complete chassis. VITA 66/67 and HOST/SOSA options available. 8” slot. 21275/SR22628105125 1838 . Elma’s line of rugged Air Transport Racks (ATRs) provide ideal cooling and reduced weight through superior. Utilizing our extensive experience in embedded. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. Cooling: Air flows around a finned, conduction cooled internal, sealed chassis and exits rear of chassis pulled by a single exhaust Tubeaxial. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Doubles as an important monitoring, data logging, and reporting device when included within deployed. Load sharing circuitry for up to 4 modules. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. 6U CompactPCI. Operating temperature range is -40°C to +85°C. GS16 is a fully rugged, fully managed, standalone Gigabit Ethernet switch providing 16 10/100/…. 0 specification for use in. 600-Watt DC/DC Converter, 6U VME. Compatible to both air cooled and conduction cooled. PXI Express Chassis. VME64x 1U/84HP 2 Slots. New High-Density 3U VPX Switches and Chassis Support Dual 100Gb Ethernet, 8x Gen4 PCIe, or 16 LVDS. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. C: -40 Operating Temp. Chassis. This platform conforms to VITA 1. PXI /. Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. 10/. Power and reset LEDs are provided for. 3V. 20 based. +70°C, ≤ 8 slots: -40°C. Single/dual cooled side walls. This switching power supply accepts a +5 VDC input and converts it to a single +3. 0 specification. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. An open-frame solution for the open-minded engineer. About. It supports up to two 0. Designed to meet the requirements of VITA 62 for use in harsh environments. 1 inch (2. 8 in. Works With: Conduction Cooled Enclosures Clamp Force: 300 – 399 lbf / 136 – 181 kg Gap Width: PCB + (0. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Orion's team of experienced engineers is available to work with you to provide a solution designed around your specific requirements. 11 Slot SOSA Development System. View product. RiCool design provides 2000W of power cooling 125W/slot (more if chassis height is increased). The chassis comes with different sizes and are equipped with various backplane options vis-à-vis 3U/6U. It is 100GbE-enabled, SOSA-aligned, and highly rugged and thermally. 3 V. MIL-STD-704F compliant except 50mSec holdup provided by separate module. External cooling configurations include natural convection cooling, forced air (fan) cooling and. Ordering Information: Dawn P/N 11-1017332. Choice of Power Supply. Victoria BC : 250-727-2890 ©2010 A&A Perfomance Chassis: Site Design by. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. 3V/25A, 5V/20A, 12V_AUX/1. 0 specification for use in Mil/Aero VPX systems. Dawn VME Products 47915 Westinghouse Drive • Fremont, CA 94539 510-657-4444 Dawn’s 3U form factor conduction cooled chassis for cold plate deployment is designed for all rugged environments: airborne, land, and sea. To suit 3U & 6U card sizes. Additionally, full military-grade conduction cooled requirements can also be accommodated with Elma’s. Over the last 20 or 30 years, as conduction cooling became established as the approach for the majority of the hottest VME- and. At ACT, we work with our customers to find the best options to reduce conduction gradients and meet. pdf; 103-7666-001_C. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. The planar heat pipes are also called vapor chambers which are used as. For all rugged environments: Air, Land, and Sea. μTCA Conduction Cooled Chassis ½ ATR with 6 AMCs. This Model Can be used to design the VITA Card Chassis. Conduction cooled VME electronics Vibration: Card-edgetempen_re: Number of VME modules 20 0. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. Includes one solid state Disc Drive Carrier mounted on the side behind front I/O panel. The power supply is thermally attached to the bulkheads for heat removal. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. 3U Conduction cooled models available in 1″ form factor. The system is designed with enhanced EMC features. 3U/6U High ATR Chassis with upto 15 Slots Card Area. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and.